optimization of the gaas-on-si substrate for microelectromechanical systems (mems) sensor application

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ID: 260344
2012
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Abstract
Resonant Tunneling Diodes (RTD) and High Electron Mobility Transistor (HEMT) based on GaAs, as the piezoresistive sensing element, exhibit extremely high sensitivity in the MEMS sensors based on GaAs. To further expand their applications to the fields of MEMS sensors based on Si, we have studied the optimization of the GaAs epitaxy layers on Si wafers. Matching superlattice and strain superlattice were used, and the surface defect density can be improved by two orders of magnitude. Combing with the Raman spectrum, the residual stress was characterized, and it can be concluded from the experimental results that the residual stress can be reduced by 50%, in comparison with the original substrate. This method gives us a solution to optimize the epitaxy GaAs layers on Si substrate, which will also optimize our future process of integration RTD and HEMT based on GaAs on Si substrate for the MEMS sensor applications.
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yu2012materialsoptimization Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors ;Ying Yu;Mifeng Li;Jifang He;Wendong Zhang;Jun Tang;Jun Liu;Zhichuan Niu;Chenyang Xue;Hao Guo;Haiqiao Ni;Yunbo Shi
Journal Nature Materials
Year 2012
DOI
10.3390/ma5122917
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