reliability criteria for thick bonding wire

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ID: 142183
2018
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Abstract
Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire.
Reference Key
dagdelen2018materialsreliability Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors ;Turker Dagdelen;Eihab Abdel-Rahman;Mustafa Yavuz
Journal Nature Materials
Year 2018
DOI
10.3390/ma11040618
URL
http://www.mdpi.com/1996-1944/11/4/618
Keywords
reliability electronics heel stresstechnologyelectrical engineering

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