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proceedings - electronic components and technology conference

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scopus
Short Name proceedings - electronic components and technology conference
Abbreviated Name proceedings - electronic components and technology conference
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Recent Articles (3 total)

2017
Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology
Miao, M.
, pp. 1880-1887
259 views DOI
2020
Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion
Kumahara, K.
Vol. 2020-June , pp. 1199-1204
181 views DOI
2011
comparative study of the mechanical properties of (fs) and mig welded joint in (aa7020-t6) aluminum alloy
;Moneer Hammed Tolephih;Kadhim M. Mashloosh;Zainab Waheed
Vol. 7 , No. 2 , pp. -
171 views Abstract
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