Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion

Clicks: 224
ID: 263897
2020
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kumahara2020lowtemperatureproceedings Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Kumahara, K.
Journal proceedings - electronic components and technology conference
Year 2020
DOI
10.1109/ECTC32862.2020.00192
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