Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

Clicks: 320
ID: 79171
2019
Free PDF
Article Quality & Performance Metrics
Overall Quality
Not rated
Combines reader engagement with the AI quality analysis. This article has not been analysed, so there is no overall score — reader engagement is measured and shown alongside.
AI Quality Assessment
Not analyzed
Readership in this journal
Steady

Ranked #137 of 485 articles by views in Nature communications

Most read Least read

Bar heights use a square-root scale. Only the 120 most-read articles are drawn; the journal has 485 in total.

Mint this article as an NFT
Not yet minted

Create a permanent, verifiable on-chain record of this article on the Scimatic Network. The NFT is held in your Journament account, and you can withdraw it to your own wallet at any time.

5 SUSD one-off · no wallet required
Sign in to mint
Abstract
Plasma-enhanced chemical vapour deposition (PECVD) is an industrially compatible microelectronics technology. Here, the authors use PECVD to obtain low-temperature, catalyst-free growth of poly-crystalline two-dimensional hexagonal-boron nitride, thus enabling superior thermal dissipation in WSe2 field-effect transistors with mobility up to 121 cm2 V−1 s−1.
Reference Key
liu2019conformalnature Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Donghua Liu, Xiaosong Chen, Yaping Yan, Zhongwei Zhang, Zhepeng Jin, Kongyang Yi, Cong Zhang, Yujie Zheng, Yao Wang, Jun Yang, Xiangfan Xu, Jie Chen, Yunhao Lu, Dapeng Wei, Andrew Thye Shen Wee, Dacheng Wei
Are you one of these authors? Claim your profile
Journal Nature communications
Year 2019
DOI
DOI not found
URL
http://link.springer.com/article/10.1038/s41467-019-09016-0
Keywords
Chemical technology Engineering (General). Civil engineering (General) Technology Archaeology Science physics

Citations

No citations found. To add a citation, contact the admin at info@scimatic.org

Comments

No comments yet. Be the first to comment on this article.