On the machinability and surface finish of cutting nanoparticle and elastomer modified epoxy

Clicks: 428
ID: 54218
2016
Free PDF
Article Quality & Performance Metrics
Overall Quality
Not rated
Combines reader engagement with the AI quality analysis. This article has not been analysed, so there is no overall score — reader engagement is measured and shown alongside.
AI Quality Assessment
Not analyzed
Readership in this journal
Steady

Ranked #13 of 88 articles by views in materials & design

Most read Least read

Bar heights use a square-root scale.

Mint this article as an NFT
Not yet minted

Create a permanent, verifiable on-chain record of this article on the Scimatic Network. The NFT is held in your Journament account, and you can withdraw it to your own wallet at any time.

5 SUSD one-off · no wallet required
Sign in to mint
Abstract
In the present paper, we investigate the material removal behaviour of epoxy-based composites in an orthogonal cutting process, and its dependence on two different fillers: a rigid nanosilica (SiO2) and a soft carboxyl-terminated butadiene-acrylonitrile (CTBN) elastomer. The results obtained show that fracture plays a key role in the formation of the newly cut surface as the chip is separated from the workpiece by the cutting tool. The surface finish after cutting is dependent on the cutting depth, h, and the ratio between fracture toughness and yield strength, Gc/σy. The latter can be determined by a cutting theory. In general, a smaller value of h and/or a higher value of Gc/σy favour the controllability of the surface finish, i.e., a stable material removal process with enhanced surface integrity. This work highlights the important role of the fillers in determining not only the mechanical properties of epoxy composites but also their machinability. It provides useful guidance for better design and processing of epoxy-based materials for different engineering applications. Keywords: Cutting, Material removal, Nanosilica and CTBN reinforced epoxy, Fracture, Surface finish
Reference Key
wang2016onmaterials Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Wang, H.;Chang, L.;Williams, J.G.;Ye, L.;Mai, Y.-W.;
Journal materials & design
Year 2016
DOI
DOI not found
URL
http://www.sciencedirect.com/science/article/pii/S0264127516310176
Keywords
microscopy Pharmacy and materia medica Materials of engineering and construction. Mechanics of materials Engineering (General). Civil engineering (General) Technology Electrical engineering. Electronics. Nuclear engineering Descriptive and experimental mechanics Science (General) social sciences (general) orthopedic surgery analytical chemistry

Citations

No citations found. To add a citation, contact the admin at info@scimatic.org

Comments

No comments yet. Be the first to comment on this article.