Multi-channel high-speed flip-chip packaging platform for thin-film lithium niobate photonic circuits

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ID: 324534
2026
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Abstract
Abstract To address the urgent need for multi-channel high-speed electrical interfacing of thin-film lithium niobate (TFLN) photonic circuits, we realize a flip-chip packaging platform capable of simultaneously delivering 13 high-speed and 32 low-speed electronic signals to a centimeter-sized TFLN chip. The platform exhibits low flip-chip bonding loss and low inter-channel crosstalk over a broad bandwidth up to 50 GHz. Leveraging this packaging platform, we demonstrate high-speed electrical interfacing with two proof-of-concept TFLN photonic circuits, namely a 2 × 8 optical switch and an electro-optic comb-based transmitter. The switch achieves arbitrary 8-channel routing with ~3 dB insertion loss, < -20 dB crosstalk, and an equipment-limited switching time of ≤ 34 ps. The transmitter circuit includes a 50 GHz electro-optic comb generator with 2.8-dB flatness, a tunable microring to arbitrarily filter one comb line, and a modulator for data transmission at 20 Gbit/s. The packaging platform could significantly advance large-scale TFLN circuits in optical communications, microwave photonics, and photonic computing.
Reference Key
openalex_W7202095748 Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Zhenzheng Wang, Xiangzhi Xie, Yikun Chen, Yifan Wu, Zeyu Luo, Hanke Feng, Yulong Chen, Zengyi Xu, Zixi Wang, Yuansong Zeng, Mandie Huang, Ke Zhang, Yingxia Liu, Cheng Wang
Journal national science review
Year 2026
DOI
10.1093/nsr/nwag480
URL
https://doi.org/10.1093/nsr/nwag480
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