Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids.

Clicks: 265
ID: 32385
2019
Article Quality & Performance Metrics
Overall Quality
Not rated
Combines reader engagement with the AI quality analysis. This article has not been analysed, so there is no overall score — reader engagement is measured and shown alongside.
AI Quality Assessment
Not analyzed
Readership in this journal
Popular

Ranked #160 of 235 articles by views in Heliyon

Most read Least read

Bar heights use a square-root scale. Only the 120 most-read articles are drawn; the journal has 235 in total.

Mint this article as an NFT
Not yet minted

Create a permanent, verifiable on-chain record of this article on the Scimatic Network. The NFT is held in your Journament account, and you can withdraw it to your own wallet at any time.

5 SUSD one-off · no wallet required
Sign in to mint
Abstract
Now a days Very-Large-Scale Integrated (VLSI) circuits are facing critical issues to satisfy the cooling demand because of shrinking the semiconductors. In this numerical work, the surface temperature of the chip, heat transfer rate, thermal resistance, power consumption and reliability are studied by using CuO/water nanofluids as coolant and compared the nanofluids results with the results of water. The CuO/water nanofluids at 0.25%, 0.5%, and 0.75% volume concentration are used for this investigation. The modelling, meshing and simulation are carried out by CATIAv5 and ANSYS Fluent v12 CFX software package. It is observed that the heat transfer rates of semiconductor using the coolant CuO/water nanofluid at 0.25%, 0.5%, and 0.75% volume concentrations are 25%, 43%, and 57% respectively higher than that of water. Found that the surface temperature of the semiconductor is lowered by 3%, 6%, and 8%, the thermal resistances decrease up to 6%, 10%, and 13%, and the Nusselt number increases by 25%, 43%, and 56%, when compared to water. It is also studied that the power consumption of the semiconductor reduces by 3%, 6%, and 8% at 0.25%, 0.5%, and 0.75% volume concentration respectively than water as coolant. It is also found that the failure rate of the semiconductor of using CuO/water nanofluids at 0.25%, 0.5%, and 0.75% volume concentration are 69%, 76%, and 84% respectively smaller than the water.
Reference Key
mukesh-kumar2019numericalheliyon Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Mukesh Kumar, P C;Arun Kumar, C M;
Journal Heliyon
Year 2019
DOI
10.1016/j.heliyon.2019.e02227
URL
Keywords Keywords not found

Citations

No citations found. To add a citation, contact the admin at info@scimatic.org

Comments

No comments yet. Be the first to comment on this article.