Embbedded System-on-Chip 3D Localization and Mapping—eSoC-SLAM

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2021
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Abstract
This paper discusses a novel embedded system-on-chip 3D localization and mapping (eSoC-LAM) implementation, that followed a co-design approach with the primary aim of being deployed in a small system on a programmable chip (SoPC), the Intel’s (a.k.a Altera) Cyclone V 5CSEMA5F31C6N, available in the Terasic’s board DE1-SoC. This computer board incorporates an 800 MHz Dual-core ARM Cortex-A9 and a Cyclone V FPGA with 85k programmable logic elements and 4450 Kbits of embedded memory running at 50 MHz. We report experiments of the eSoC-LAM implementation using a Robosense’s 3D LiDAR RS-16 sensor in a Robotis’ TurtleBot2 differential robot, both controlled by a Terasic’s board DE1-SoC. This paper presents a comprehensive description of the designed architecture, design constraints, resource optimization, HPS-FPGA exchange of information, and co-design results. The eSoC-LAM implementation reached an average speed-up of 6.5× when compared with a version of the algorithm running in a the hard processor system of the Cyclone V device, and a performance of nearly 32 fps, while keeping high map accuracy.
Reference Key
gerlein2021electronicsembbedded Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Eduardo A. Gerlein;Gabriel Díaz-Guevara;Henry Carrillo;Carlos Parra;Enrique Gonzalez;Gerlein, Eduardo A.;Díaz-Guevara, Gabriel;Carrillo, Henry;Parra, Carlos;Gonzalez, Enrique;
Journal Electronics
Year 2021
DOI
10.3390/electronics10121378
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