particle based alloying by accumulative roll bonding in the system al-cu
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ID: 173052
2011
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Abstract
The formation of alloys by particle reinforcement during accumulative roll bonding (ARB), and subsequent annealing, is introduced on the basis of the binary alloy system Al-Cu, where strength and electrical conductivity are examined in different microstructural states. An ultimate tensile strength (UTS) of 430 MPa for Al with 1.4 vol.% Cu was reached after three ARB cycles, which almost equals UTS of the commercially available Al-Cu alloy AA2017A with a similar copper content. Regarding electrical conductivity, the UFG structure had no significant influence. Alloying of aluminum with copper leads to a linear decrease in conductivity of 0.78 µΩ∙cm/at.% following the Nordheim rule. On the copper-rich side, alloying with aluminum leads to a slight strengthening, but drastically reduces conductivity. A linear decrease of electrical conductivity of 1.19 µΩ∙cm/at.% was obtained.
| Reference Key |
gken2011metalsparticle
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|---|---|
| Authors | ;Mathias Göken;Heinz Werner Höppel;Christian W. Schmidt;Patrick Knödler |
| Journal | seminars in cancer biology |
| Year | 2011 |
| DOI |
10.3390/met1010065
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| URL | |
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