effect of flux onto intermetallic compound formation and growth
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ID: 139572
2016
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Abstract
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.
| Reference Key |
aisha2016mateceffect
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|---|---|
| Authors | ;Idris Siti Rabiatull Aisha;Farihan Noor;Kahar Hardinnawirda |
| Journal | acta botânica brasílica |
| Year | 2016 |
| DOI |
10.1051/matecconf/20167400034
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| URL | |
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