Explosion Suppression Mechanism Characteristics of MEMS S&A Device With In Situ Synthetic Primer.

Clicks: 150
ID: 88857
2018
Article Quality & Performance Metrics
Overall Quality
Not rated
Combines reader engagement with the AI quality analysis. This article has not been analysed, so there is no overall score — reader engagement is measured and shown alongside.
AI Quality Assessment
Not analyzed
Readership in this journal
Steady

Ranked #104 of 128 articles by views in micromachines

Most read Least read

Bar heights use a square-root scale. Only the 120 most-read articles are drawn; the journal has 128 in total.

Mint this article as an NFT
Not yet minted

Create a permanent, verifiable on-chain record of this article on the Scimatic Network. The NFT is held in your Journament account, and you can withdraw it to your own wallet at any time.

5 SUSD one-off · no wallet required
Sign in to mint
Abstract
The traditional silicon-based micro-electro-mechanical systems (MEMS) safety and arming (S&A) device fuze cannot isolate abnormal outputs in the detonation environment, which creates hazards for personnel. To address this problem, we report the design of a MEMS S&A device with integrated silver, copper, nickel and polyimide (PI) films, which is based on the principle of a MEMS S&A device and uses copper azide as the primer. The MEMS S&A device was optimized using theoretical calculations of the explosion suppression mechanism performance in a detonation field, where the theoretical model was verified by dynamic simulation (LS-Dyna). Silicon-based MEMS processing technology was used to integrate the MEMS S&A device with energy-absorbing materials, and the device performance was compared in detonation tests. Silicon-based MEMS S&A devices with silver, copper, nickel, and PI (100-μm-thick) achieved a reliable explosion suppression mechanism capability when exposed to a detonation wave. The residual stress was measured using Raman microscopy, and the PI film exhibited the best explosion suppression mechanism performance of the four materials. A reliability test to determine the maximum explosion suppression mechanism dose for a MEMS S&A device attached to a PI film (100-μm-thick) showed that the maximum amount of primer needed for the effective explosion suppression mechanism capability on the MEMS S&A device was 0.45 mg.
Reference Key
feng2018explosionmicromachines Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Feng, Hengzhen;Lou, Wenzhong;Wang, Dakui;Zheng, Fuquan;
Journal micromachines
Year 2018
DOI
E652
URL
Keywords
mems safety and arming device energy absorbing material explosion suppression mechanism explosion suppression mechanism reliability

Citations

No citations found. To add a citation, contact the admin at info@scimatic.org

Comments

No comments yet. Be the first to comment on this article.