Exploration of bonding phenomenon and microstructural characterization during high-power ultrasonic spot welding of aluminum to steel sheets with copper interlayer

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ID: 77539
2019
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satpathy2019explorationain Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Satpathy, M.
Journal ain shams engineering journal
Year 2019
DOI
10.1016/j.asej.2019.07.007
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