Growth Characterization of Intermetallic Compound at the Ti/Al Solid State Interface.

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ID: 77516
2019
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Abstract
Ti-Al diffusion couples, prepared by resistance spot welding, were annealed up to 112 hours at 823, 848, and 873 K in ambient atmosphere. The interfacial microstructure was observed and analyzed using SEM and TEM. The growth characterization of intermetallic compound formed at the Ti/Al solid state interface was investigated. Only TiAl₃ phase was detected in the interfacial zone, and its growth was governed by reaction-controlled mechanism in the previous period and by diffusion-controlled mechanism in the latter period. The activation energies were 198019 and 122770 J/mol for reaction-controlled and diffusion-controlled mechanism, respectively.
Reference Key
zhao2019growthmaterials Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Zhao, Yangyang;Li, Jiuyong;Qiu, Ranfeng;Shi, Hongxin;
Journal Materials (Basel, Switzerland)
Year 2019
DOI
E472
URL
Keywords
titanium aluminum tial3 growth kinetic Image processing infrared thermography canopy temperature crop water stress index

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