Growth Characterization of Intermetallic Compound at the Ti/Al Solid State Interface.

Clicks: 199
ID: 77516
2019
Article Quality & Performance Metrics
Overall Quality Improving Quality
9.0 /100
Combines engagement data with AI-assessed academic quality
AI Quality Assessment
Not analyzed
Abstract
Ti-Al diffusion couples, prepared by resistance spot welding, were annealed up to 112 hours at 823, 848, and 873 K in ambient atmosphere. The interfacial microstructure was observed and analyzed using SEM and TEM. The growth characterization of intermetallic compound formed at the Ti/Al solid state interface was investigated. Only TiAl₃ phase was detected in the interfacial zone, and its growth was governed by reaction-controlled mechanism in the previous period and by diffusion-controlled mechanism in the latter period. The activation energies were 198019 and 122770 J/mol for reaction-controlled and diffusion-controlled mechanism, respectively.
Reference Key
zhao2019growthmaterials Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Zhao, Yangyang;Li, Jiuyong;Qiu, Ranfeng;Shi, Hongxin;
Journal Materials (Basel, Switzerland)
Year 2019
DOI
E472
URL
Keywords
titanium aluminum tial3 growth kinetic Image processing infrared thermography canopy temperature crop water stress index

Citations

No citations found. To add a citation, contact the admin at info@scimatic.org

Comments

No comments yet. Be the first to comment on this article.