Preparation and Characterization of Printed LTCC Substrates for Microwave Devices
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2019
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Abstract
A novel LTCC substrate manufacturing process based on 3D printing was investigated in this paper. Borosilicate glass-alumina substrates with controlled size and thickness were successfully manufactured using a self-developed dual-nozzle hybrid printing system. The printing parameters were carefully analyzed. The mechanical and dielectric properties of the printed substrate were examined. The results show that the printed substrates obtain smooth surface (
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yanfeng2019preparationactive
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| Authors | Shi, Yanfeng;Chai, Yongqiang;Hu, Shengbo;Shi, Yanfeng;Chai, Yongqiang;Hu, Shengbo; |
| Journal | active and passive electronic components |
| Year | 2019 |
| DOI |
10.1155/2019/6473587
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| URL | |
| Keywords | Keywords not found |
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