Preparation and Characterization of Printed LTCC Substrates for Microwave Devices

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ID: 7695
2019
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Abstract
A novel LTCC substrate manufacturing process based on 3D printing was investigated in this paper. Borosilicate glass-alumina substrates with controlled size and thickness were successfully manufactured using a self-developed dual-nozzle hybrid printing system. The printing parameters were carefully analyzed. The mechanical and dielectric properties of the printed substrate were examined. The results show that the printed substrates obtain smooth surface (
Reference Key
yanfeng2019preparationactive Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Shi, Yanfeng;Chai, Yongqiang;Hu, Shengbo;Shi, Yanfeng;Chai, Yongqiang;Hu, Shengbo;
Journal active and passive electronic components
Year 2019
DOI
10.1155/2019/6473587
URL
https://www.hindawi.com/journals/apec/2019/6473587/abs/
Keywords Keywords not found

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