Self-Assembled Flexible and Integratable 3D Microtubular Asymmetric Supercapacitors.

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ID: 66502
2019
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Ranked #22 of 57 articles by views in Advanced science (Weinheim, Baden-Wurttemberg, Germany)

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Abstract
The rapid development of microelectronics has equally rapidly increased the demand for miniaturized energy storage devices. On-chip microsupercapacitors (MSCs), as promising power candidates, possess great potential to complement or replace electrolytic capacitors and microbatteries in various applications. However, the areal capacities and energy densities of the planar MSCs are commonly limited by the low voltage window, the thin layer of the electrode materials and complex fabrication processes. Here, a new-type three-dimensional (3D) tubular asymmetric MSC with small footprint area, high potential window, ultrahigh areal energy density, and long-term cycling stability is fabricated with shapeable materials and photolithographic technologies, which are compatible with modern microelectronic fabrication procedures widely used in industry. Benefiting from the novel architecture, the 3D asymmetric MSC displays an ultrahigh areal capacitance of 88.6 mF cm and areal energy density of 28.69 mW h cm, superior to most reported interdigitated MSCs. Furthermore, the 3D tubular MSCs demonstrate remarkable cycling stability and the capacitance retention is up to 91.8% over 12 000 cycles. It is believed that the efficient fabrication methodology can be used to construct various integratable microscale tubular energy storage devices with small footprint area and high performance for miniaturized electronics.
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li2019selfassembledadvanced Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Li, Fei;Wang, Jinhui;Liu, Lixiang;Qu, Jiang;Li, Yang;Bandari, Vineeth Kumar;Karnaushenko, Daniil;Becker, Christian;Faghih, Maryam;Kang, Tong;Baunack, Stefan;Zhu, Minshen;Zhu, Feng;Schmidt, Oliver G;
Journal Advanced science (Weinheim, Baden-Wurttemberg, Germany)
Year 2019
DOI
10.1002/advs.201901051
URL
Keywords
3d microtubular architecture footprints integrated devices microsupercapacitors rolled‐up nanotechnology

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