Quadrilateral Micro-Hole Array Machining on Invar Thin Film: Wet Etching and Electrochemical Fusion Machining
Clicks: 304
ID: 54274
2018
Article Quality & Performance Metrics
Overall Quality
Improving Quality
0.5
/100
Combines engagement data with AI-assessed academic quality
Reader Engagement
Emerging Content
1.5
/100
5 views
5 readers
Trending
AI Quality Assessment
Not analyzed
Abstract
Ultra-precision products which contain a micro-hole array have recently shown remarkable demand growth in many fields, especially in the semiconductor and display industries. Photoresist etching and electrochemical machining are widely known as precision methods for machining micro-holes with no residual stress and lower surface roughness on the fabricated products. The Invar shadow masks used for organic light-emitting diodes (OLEDs) contain numerous micro-holes and are currently machined by a photoresist etching method. However, this method has several problems, such as uncontrollable hole machining accuracy, non-etched areas, and overcutting. To solve these problems, a machining method that combines photoresist etching and electrochemical machining can be applied. In this study, negative photoresist with a quadrilateral hole array pattern was dry coated onto 30-µm-thick Invar thin film, and then exposure and development were carried out. After that, photoresist single-side wet etching and a fusion method of wet etching-electrochemical machining were used to machine micro-holes on the Invar. The hole machining geometry, surface quality, and overcutting characteristics of the methods were studied. Wet etching and electrochemical fusion machining can improve the accuracy and surface quality. The overcutting phenomenon can also be controlled by the fusion machining. Experimental results show that the proposed method is promising for the fabrication of Invar film shadow masks.
| Reference Key |
choi2018quadrilateralmaterials
Use this key to autocite in the manuscript while using
SciMatic Manuscript Manager or Thesis Manager
|
|---|---|
| Authors | Choi, Woong-Kirl;Kim, Seong-Hyun;Choi, Seung-Geon;Lee, Eun-Sang; |
| Journal | Materials (Basel, Switzerland) |
| Year | 2018 |
| DOI |
DOI not found
|
| URL | |
| Keywords |
chemistry
microscopy
Materials of engineering and construction. Mechanics of materials
Engineering (General). Civil engineering (General)
Industrial electrochemistry
Technology
Electrical engineering. Electronics. Nuclear engineering
Descriptive and experimental mechanics
Mechanical engineering and machinery
chemical engineering
motor vehicles. aeronautics. astronautics
computer engineering. computer hardware
mechanics of engineering. applied mechanics
|
Citations
No citations found. To add a citation, contact the admin at info@scimatic.org
Comments
No comments yet. Be the first to comment on this article.