Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes

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2019
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busek2019thermomechanicalproceedings Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Busek, D.
Journal proceedings of the international spring seminar on electronics technology
Year 2019
DOI
10.1109/ISSE.2019.8810299
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