Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review.

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ID: 42949
2019
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Abstract
The significant advance of power electronics in today's market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the high junction temperature, low power losses, and excellent thermal stability, and thus are attractive to converters and MEMS devices applied in a high-temperature environment. This paper conducts an overview of high-temperature power electronics, with a focus on high-temperature converters and MEMS devices. The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology. Then, the research and development directions of SiC-based high-temperature converters in the fields of motor drives, rectifier units, DC-DC converters are discussed, as well as MEMS devices. Finally, the existing technical challenges facing high-temperature power electronics are identified, including gate drives, current measurement, parameters matching between each component, and packaging technology.
Reference Key
guo2019siliconmicromachines Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Guo, Xiaorui;Xun, Qian;Li, Zuxin;Du, Shuxin;
Journal micromachines
Year 2019
DOI
E406
URL
Keywords
mems devices sic power electronic devices high-temperature converters power electronics underwater acoustic sensor networks media access control (mac) spatial–temporal mapping

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