The Realization of Redistribution Layers for FOWLP by Inkjet Printing

Clicks: 191
ID: 36924
2018
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Abstract
The implementation of additive manufacturing technology (e.g., digital printing) to the electronic packaging segment has recently received increasing attention. In almost all types of Fan-out wafer level packaging (FOWLP), redistribution layers (RDLs) are formed by a combination of photolithography, sputtering and plating process. Alternatively, in this study, inkjet-printed RDLs were introduced for FOWLP. In contrast to a subtractive method (e.g., photolithography), additive manufacturing techniques allow depositing the material only where it is desired. In the current study, RDL structures for different embedded modules were realized by inkjet printing and further characterized by electrical examinations. It was proposed that a digital printing process can be a more efficient and lower-cost solution especially for rapid prototyping of RDLs, since several production steps will be skipped, less material will be wasted and the supply chain will be shortened.
Reference Key
roshanghias2018btheproceedings Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Roshanghias, Ali;Ma, Ying;Dreissigacker, Marc ;Braun, Tanja ;Bretthauer, Christian;Becker, Karl-F. ;Schneider-Ramelow, Martin ;
Journal proceedings
Year 2018
DOI
DOI not found
URL
https://www.mdpi.com/2504-3900/2/13/703
Keywords Keywords not found

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