N-doped graphene-based copper nanocomposite with ultralow electrical resistivity and high thermal conductivity

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ID: 31486
2018
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Abstract
Abstract Nanocomposite with a room-temperature ultra-low resistivity far below that of conventional metals like copper is considered as the next generation conductor. However, many technical and scientific problems are encountered in the fabrication of such nanocomposite materials at present. Here, we report the rapid and efficient fabrication and characterization of a novel nitrogen-doped graphene-copper nanocomposite. Silk fibroin was used as a precursor and placed on a copper substrate, followed by the microwave plasma treatment. This resulted nitrogen-doped graphene-copper composite possesses an electrical resistivity of 0.16 µΩ·cm at room temperature, far lower than that of copper. In addition, the composite has superior thermal conductivity (538 W/m·K at 25 °C) which is 138% of copper. The combination of excellent thermal conductivity and ultra-low electrical resistivity opens up potentials in next-generation conductors.
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zheng2018ndopedscientific Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Zheng, Liang;Zheng, Hui;Huo, Dexuan;Wu, Feimei;Shao, Lihuan;Zheng, Peng;Jiang, Yuan;Zheng, Xiaolong;Qiu, Xinping;Liu, Yan;Zhang, Yang;
Journal Scientific reports
Year 2018
DOI
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URL
http://link.springer.com/article/10.1038/s41598-018-27667-9
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