3D System Design: A Case for Building Customized Modular Systems in 3D
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ID: 283373
2024
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Abstract
3D promises a new dimension in composing systems by aggregating chips.
Literally. While the most common uses are still tightly connected with its
early forms as a packaging technology, new application domains have been
emerging. As the underlying technology continues to evolve, the unique
leverages of 3D have become increasingly appealing to a larger range of
applications: from embedded mobile applications to servers and memory systems.
In this paper we focus on the system-level implications of 3D technology,
trying to differentiate the unique advantages that it provides to different
market segments and applications.
| Reference Key |
kurshan20243d
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|---|---|
| Authors | Philip Emma; Eren Kurshan |
| Journal | arXiv |
| Year | 2024 |
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