Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors

Clicks: 92
ID: 275931
2023
Article Quality & Performance Metrics
Overall Quality Improving Quality
0.0 /100
Combines engagement data with AI-assessed academic quality
AI Quality Assessment
Not analyzed
Abstract
Abstract is not available for this article.
Login to Search Abstract
Reference Key
zhao2023chemicalapplied Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Zhao, S.
Journal Applied Surface Science
Year 2023
DOI
10.1016/j.apsusc.2022.155165
URL
Keywords Keywords not found

Citations

No citations found. To add a citation, contact the admin at info@scimatic.org

Comments

No comments yet. Be the first to comment on this article.