Temperature Difference Sensor to Monitor the Temperature Difference in Processor Active Heat Sink Based on Thermopile

Klik: 225
ID: 274326
2021
PDF Gratis
Metrik Kualitas & Kinerja Artikel
Kualitas Keseluruhan
Not rated
Combines reader engagement with the AI quality analysis. This article has not been analysed, so there is no overall score — reader engagement is measured and shown alongside.
Penilaian Kualitas AI
Belum dianalisis
Readership in this journal
Emerging

Ranked #75 of 113 articles by views in Electronics

Most read Least read

Bar heights use a square-root scale.

Mint this article as an NFT
Not yet minted

Create a permanent, verifiable on-chain record of this article on the Scimatic Network. The NFT is held in your Journament account, and you can withdraw it to your own wallet at any time.

5 SUSD one-off · no wallet required
Sign in to mint
Abstrak
The monitoring of processor temperature is crucial to increase its efficiency. One of the novel approaches is use the information not only about the CPU (Central Processing Unit) thermal state, but also about changing environmental conditions. The additional temperature difference sensor to monitor thermal changes in the processor environment is necessary. The sensor dedicated for active heat sink, often used inside laptops, was designed, fabricated and investigated. To fulfill the requirements and to match to the specific shape of the active heat sink, the hybrid sensor was proposed. It was composed of six thermocouples and fabricated using thick-film and LTCC (Low Temperature Cofired Ceramic) technology combined with wire thermocouples. Thick-film/LTCC flat substrates with thermoelectric paths ensured good thermal contact between the sensor and the monitored surface. The thermoelectric wires allowed adjusting the sensor to the complicated shape of the active heatsink. Three different versions of the sensor were realized and compared. All of them seem to be suitable for measuring the temperature difference in the given application and they can be used in further works.
Kunci Referensi
markowski2021electronicstemperature Gunakan kunci ini untuk mengutip otomatis dalam naskah saat menggunakan SciMatic Manuscript Manager atau Thesis Manager
Penulis Piotr Marek Markowski;Mirosław Gierczak;Andrzej Dziedzic;Markowski, Piotr Marek;Gierczak, Mirosław;Dziedzic, Andrzej;
Jurnal Electronics
Tahun 2021
DOI
10.3390/electronics10121410
URL
https://www.mdpi.com/2079-9292/10/12/1410
Kata Kunci
cpu thermoelectric sensor thermoelectricity thick film heat sink ltcc

Sitasi

Tidak ada sitasi yang ditemukan. Untuk menambahkan sitasi, hubungi admin di info@scimatic.org

Komentar

Belum ada komentar. Jadilah yang pertama berkomentar pada artikel ini.