properties and microstructures of sn-bi-x lead-free solders

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ID: 218344
2016
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Abstract
The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.
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yang2016advancesproperties Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Fan Yang, Liang Zhang, Zhi-quan Liu, Su-juan Zhong, Jia Ma, Li Bao
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Journal bulletin of the korean chemical society
Year 2016
DOI
10.1155/2016/9265195
URL
http://dx.doi.org/10.1155/2016/9265195
Keywords
materials of engineering and construction mechanics of materials

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