Stresses evolution at high temperature (200°C) on the interface of thin films in magnetic components

In the field of electronics, the increase of operating temperatures is a major industrial and scientific challenge because it allows reducing mass and volume of components especially in the aeronautic domain. So minimizing our components reduce masses and the use of cooling systems. For that, the behaviours and interface stresses of our components (in particular magnetic inductors and transformers) that are constituted of one magnetic layer (YIG) or an alumina substrate (Al2O3) representing the substrate and a thin copper film are studied at high temperature (200°C). COMSOL Multiphysics is used to simulate our work and to validate our measurements results. In this paper, we will present stresses results according to the geometrical copper parameters necessary for the component fabrication. Results show that stresses increase with temperature and copper’s thickness while remaining always lower than 200MPa which is the rupture stress value.