3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review.

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ID: 156656
2020
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Abstract
The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility in production from macro to micro-MID products, high fracture toughness when subjected to mechanical loading, and they are lightweight. This survey proposes a detailed review of different types of 3D-MID modules, also presents the requirement criteria for manufacture a polymer substrate and the main surface modification techniques used to enhance the polymer substrate. The findings presented here allow to fundamentally understand the concept of 3D-MID, which can be used to manufacture a novel polymer composite substrate.
Reference Key
tengsuthiwat20203dmidpolymers Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Tengsuthiwat, Jiratti;Sanjay, Mavinkere Rangappa;Siengchin, Suchart;Pruncu, Catalin I;
Journal Polymers
Year 2020
DOI
E1408
URL
Keywords
polymer surface modification composites 3d-mid technology

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