A systematic review of the endoscopic repair of cerebrospinal fluid leaks

Clicks: 329
ID: 118215
2012
Free PDF
Article Quality & Performance Metrics
Overall Quality
Not rated
Combines reader engagement with the AI quality analysis. This article has not been analysed, so there is no overall score — reader engagement is measured and shown alongside.
AI Quality Assessment
Not analyzed
Readership in this journal
Popular

Ranked #6 of 8 articles by views in otolaryngology--head and neck surgery : official journal of american academy of otolaryngology-head and neck surgery

Most read Least read

Bar heights use a square-root scale.

Mint this article as an NFT
Not yet minted

Create a permanent, verifiable on-chain record of this article on the Scimatic Network. The NFT is held in your Journament account, and you can withdraw it to your own wallet at any time.

5 SUSD one-off · no wallet required
Sign in to mint
Abstract
The endoscopic repair of CSF fistula is both safe and effective and should be considered the standard of care for most cases. Evidence supporting adjunctive measures such as lumbar drains and antibiotics remains limited despite their common use.
Reference Key
aj2012otolaryngology--heada Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Psaltis AJ;Schlosser RJ;Banks CA;Yawn J;Soler ZM;;
Journal otolaryngology--head and neck surgery : official journal of american academy of otolaryngology-head and neck surgery
Year 2012
DOI
DOI not found
URL
http://www.ncbi.nlm.nih.gov/pubmed/22706995
Keywords
systematic review National Center for Biotechnology Information NCBI NLM MEDLINE review humans pubmed abstract nih national institutes of health national library of medicine cerebrospinal fluid leak cerebrospinal fluid rhinorrhea / surgery* endoscopy* pmid:22706995 doi:10.1177/0194599812451090 alkis j psaltis rodney j schlosser zachary m soler

Citations

No citations found. To add a citation, contact the admin at info@scimatic.org

Comments

No comments yet. Be the first to comment on this article.