Structural and Electrical Properties of Flexible ITO/In2O3 Thermocouples on PI Substrates under Tensile Stretching

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ID: 117115
2019
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Reference Key
zhang2019acsstructural Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Peng Shi,Weichao Wang,Dan Liu,Jie Zhang,Wei Ren,Bian Tian,Junzhan Zhang;Peng Shi;Weichao Wang;Dan Liu;Jie Zhang;Wei Ren;Bian Tian;Junzhan Zhang;
Journal acs applied electronic materials
Year 2019
DOI
10.1021/acsaelm.9b00103
URL
https://sciprofiles.com/publication/view/5f75faa96381111b01fdfd2b1cc53b25
Keywords
toughness films Structural ito tensile in2o3 flexible thin film thermocouples

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