System-on-Chip Integration of a New Electromechanical Impedance Calculation Method for Aircraft Structure Health Monitoring
Clicks: 206
ID: 112882
2012
Article Quality & Performance Metrics
Overall Quality
Not rated
Combines reader engagement with the AI quality analysis. This
article has not been analysed, so there is no overall score —
reader engagement is measured and shown alongside.
Reader Engagement
Popular Article
30.0
/100
206 views
30 readers
AI Quality Assessment
Not analyzed
Readership in this journal
PopularRanked #1,348 of 1,694 articles by views in sensors
Most read
Least read
Bar heights use a square-root scale. Only the 120 most-read articles are drawn; the journal has 1,694 in total.
Mint this article as an NFT
Not yet mintedCreate a permanent, verifiable on-chain record of this article on the Scimatic Network. The NFT is held in your Journament account, and you can withdraw it to your own wallet at any time.
5
SUSD
one-off · no wallet required
Abstract
The work reported on this paper describes a new methodology implementation for active structural health monitoring of recent aircraft parts made from carbon-fiber-reinforced polymer. This diagnosis is based on a new embedded method that is capable of measuring the local high frequency impedance spectrum of the structure through the calculation of the electro-mechanical impedance of a piezoelectric patch pasted non-permanently onto its surface. This paper involves both the laboratory based E/M impedance method development, its implementation into a CPU with limited resources as well as a comparison with experimental testing data needed to demonstrate the feasibility of flaw detection on composite materials and answer the question of the method reliability. The different development steps are presented and the integration issues are discussed. Furthermore, we present the unique advantages that the reconfigurable electronics through System-on-Chip (SoC) technology brings to the system scaling and flexibility. At the end of this article, we demonstrate the capability of a basic network of sensors mounted onto a real composite aircraft part specimen to capture its local impedance spectrum signature and to diagnosis different delamination sizes using a comparison with a baseline.
| Reference Key |
boukabache2012sensorssystem-on-chip
Use this key to autocite in the manuscript while using
SciMatic Manuscript Manager or Thesis Manager
|
|---|---|
| Authors | Hamza Boukabache;Christophe Escriba;Sabeha Zedek;Daniel Medale;Sebastien Rolet;Jean Yves Fourniols;Boukabache, Hamza;Escriba, Christophe;Zedek, Sabeha;Medale, Daniel;Rolet, Sebastien;Fourniols, Jean Yves; |
| Journal | sensors |
| Year | 2012 |
| DOI |
10.3390/s121013617
|
| URL | |
| Keywords |
Citations
No citations found. To add a citation, contact the admin at info@scimatic.org
Comments
No comments yet. Be the first to comment on this article.