Powder Filling and Sintering of 3D In-chip Solenoid Coils with High Aspect Ratio Structure.

Clicks: 241
ID: 103094
2020
Article Quality & Performance Metrics
Overall Quality
Not rated
Combines reader engagement with the AI quality analysis. This article has not been analysed, so there is no overall score — reader engagement is measured and shown alongside.
AI Quality Assessment
Not analyzed
Readership in this journal
Emerging

Ranked #59 of 128 articles by views in micromachines

Most read Least read

Bar heights use a square-root scale. Only the 120 most-read articles are drawn; the journal has 128 in total.

Mint this article as an NFT
Not yet minted

Create a permanent, verifiable on-chain record of this article on the Scimatic Network. The NFT is held in your Journament account, and you can withdraw it to your own wallet at any time.

5 SUSD one-off · no wallet required
Sign in to mint
Abstract
In this study, a 3D coil embedded in a silicon substrate including densely distributed through-silicon vias (TSVs) was fabricated via a rapid metal powder sintering process. The filling and sintering methods for microdevices were evaluated, and the effects of powder types were compared. The parameters influencing the properties and processing speed were analyzed. The results showed that the pre-alloyed powder exhibited the best uniformity and stability when the experiment used two or more types of powders to avoid the segregation effect. The smaller the particle diameter, the better the inductive performance will be. The entire structure can be sintered near the melting point of the alloy, and increasing the temperature increases strength, while resulting in low resistivity. Finally, an 800-µm-high coil was fabricated. This process does not need surface metallization and seed layer formation. The forming process involves only sintering instead of slowly growing copper with a tiny current. Therefore, this process has advantages, such as a process time of 7 h, corresponding to an 84% reduction compared to current electroplating processes (45 h), and a 543% efficiency improvement. Thus, this process is more efficient, controllable, stable, and suitable for mass production of devices with flexible dimensions.
Reference Key
huang2020powdermicromachines Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Huang, Yujia;Li, Haiwang;Sun, Jiamian;Zhai, Yanxin;Li, Hanqing;Xu, Tiantong;
Journal micromachines
Year 2020
DOI
E328
URL
Keywords
metal powder sintering microelectromechanical system (mems) powder filling three-dimensional (3d) solenoid coils through-silicon-vias (tsvs) in vitro in vivo drug interaction (‒)-sophoranone cyp2c9 high plasma protein binding low permeability potent inhibition

Citations

No citations found. To add a citation, contact the admin at info@scimatic.org

Comments

No comments yet. Be the first to comment on this article.