Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology
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2017
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| Reference Key |
miao2017dataproceedings
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|---|---|
| Authors | Miao, M. |
| Journal | proceedings - electronic components and technology conference |
| Year | 2017 |
| DOI | 10.1109/ECTC.2017.85 |
| URL | |
| Keywords | Keywords not found |
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