Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

Clicks: 233
ID: 79171
2019
Plasma-enhanced chemical vapour deposition (PECVD) is an industrially compatible microelectronics technology. Here, the authors use PECVD to obtain low-temperature, catalyst-free growth of poly-crystalline two-dimensional hexagonal-boron nitride, thus enabling superior thermal dissipation in WSe2 field-effect transistors with mobility up to 121 cm2 V−1 s−1.
Reference Key
liu2019conformalnature Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Liu, Donghua;Chen, Xiaosong;Yan, Yaping;Zhang, Zhongwei;Jin, Zhepeng;Yi, Kongyang;Zhang, Cong;Zheng, Yujie;Wang, Yao;Yang, Jun;Xu, Xiangfan;Chen, Jie;Lu, Yunhao;Wei, Dapeng;Wee, Andrew Thye Shen;Wei, Dacheng;
Journal Nature communications
Year 2019
DOI DOI not found
URL
http://link.springer.com/article/10.1038/s41467-019-09016-0
Keywords
Chemical technology Engineering (General). Civil engineering (General) Technology Archaeology Science physics

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