The recycling of comminuted glass-fiber-reinforced resin from electronic waste.

Abstract

The reuse of comminuted glass-fiber-reinforced resin with various granularities gathered from printed circuit manufacturing residues was investigated. As fillers, these residues were converted into polymeric composite board by an extrusion and injection process using polypropylene as a bonding agent. The mechanical properties of the reproduced composite board were examined by considering the effects of mass fraction and glass-fiber distribution. Interfacial-layer micrograph analysis of the composite material fracture surface was used to study the fiber reinforcement mechanism. Results showed that using comminuted glass-fiber-reinforced resin as a filler material greatly enhanced the performance properties of the composite board. Although the length and diameter of filler varied, these variations had no appreciable effect on the mechanical properties of the processed board. Maximum values of 48.30 MPa for flexural strength, 31.34 MPa for tensile strength, and 31.34 J/m for impact strength were achieved from a composite board containing mass fractions of 30, 10, and 20% glass-fiber-reinforced resin waste, respectively. It was found that the maximum amount of recyclate that could be added to a composite board was 30% of weight. Beyond these percentages, the materials blend became unmanageable and the mixture less amenable to impregnation with fiber. Presented studies indicated that comminuted glass-fiber-reinforced resin waste-filled polypropylene composites are promising candidates for structural applications where high stiffness and fracture resistance are required.