Three-Mask Fabrication and Optimized Design of First-Level Free-Standing Interconnect for Microelectronics Application

Clicks: 152
ID: 66537
2003
Article Quality & Performance Metrics
Overall Quality Improving Quality
0.0 /100
Combines engagement data with AI-assessed academic quality
AI Quality Assessment
Not analyzed
Reference Key
zhu2003threemaskamerican Use this key to autocite in the manuscript while using SciMatic Manuscript Manager or Thesis Manager
Authors Zhu, Q.
Journal american society of mechanical engineers, electronic and photonic packaging, epp
Year 2003
DOI 10.1115/IMECE2003-41833
URL
Keywords Keywords not found

Citations

No citations found. To add a citation, contact the admin at info@scimatic.org

No comments yet. Be the first to comment on this article.