Three-Mask Fabrication and Optimized Design of First-Level Free-Standing Interconnect for Microelectronics Application
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2003
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zhu2003threemaskamerican
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Authors | Zhu, Q. |
Journal | american society of mechanical engineers, electronic and photonic packaging, epp |
Year | 2003 |
DOI | 10.1115/IMECE2003-41833 |
URL | |
Keywords | Keywords not found |
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