Finite element modeling of temporary bonding systems for flexible microelectronics fabrication
Clicks: 241
ID: 66527
2012
| Reference Key |
haq2012finitemicroelectronic
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|---|---|
| Authors | Haq, J. |
| Journal | microelectronic engineering |
| Year | 2012 |
| DOI | 10.1016/j.mee.2012.01.003 |
| URL | |
| Keywords | Keywords not found |
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